Our present day world exists more and more of chip using devices. The question that we all, knowingly or unknowingly, ask of ASML is a simple one: could you please make sure that chips keep getting cheaper? Being able to satisfy this need asks an almost Olympic effort of ASML: making it faster, higher, stronger, or as the Romans put it, Citius, Altius, Fortius. After a short introduction of the lithography business in general and ASML in particular, three technical challenges will be addressed. Speeding up the lithography process, adding more accuracy to enable the correct alignment of layer upon layer upon layer, and ensuring that every square inch of silicon that enters into the process of becoming a chip endures untill the very end.
